Packaging

Leistungsangebot Packaging

Wärmesenken

  • Diodenlaser
  • Slablaser
  • CTE angepasst
  • Auslegung aktiver und passiver Wärmesenken

Komponentenmontage

  • Optikmontage
  • Diodenlaserbarren
  • Slablaser
  • Elektrooptische Komponenten
  • VCSEL

Montageprozesse

  • Pick & Place
  • Greiferentwicklung
  • Fügeprozess

Prüfstände

  • Burn-In
  • Charakterisierung
  • Divergenzwinkel Messplatz
  • Smile Messung
  • DOP-Verspannung
  • Kurzpuls Messstand

Publikationen

Livrozet, M. J., Elsen, F., Wüppen, J., Löhring, J., Büdenbender, C., Fix, A., Jungbluth, B., Hoffmann, D.:
Feasibility and performance study for a space-borne 1645 nm OPO for French-German satellite mission MERLIN
Proc. SPIE 8959, 89590G (7) (2014)

Brecher, C., Schmitt, R., Loosen, P., Guerrero, V., Pyschny, N., Pavim, A., Gatej, A.:
Self-optimizing approach for automated laser resonator alignment
Opt. Lasers Eng. 50, 287-292, (2012)

Faidel, H., Gronloh, B., Winzen, M., Liermann, E., Esser, D., Morasch, V., Luttmann, J., Leers, M., Hoffmann, D.:
Passive alignment and soldering technique for optical components
Proc. SPIE 8235, 10 S., (2012)

Gatej, A., Pyschny, N., Loosen, P., Brecher, C.:
Robot-based Resistance Soldering of Optical Components
Soldering & Surface Mount Technology Vol. 24, no. 2, pp. 112-119, (2012)

Leers, M., Winzen, M., Liermann, E., Faidel, H., Westphalen, T., Miesner, J., Luttmann, J., Hoffmann, D.:
Highly precise and robust packaging of optical components
Proc. SPIE 8244, 6 S. (2012)

Leers, M., Winzen, M., Liermann, E., Faidel, H., Westphalen, T., Miesner, J., Luttmann, J., Hoffmann, D.:
Pick and align - high precision active alignment of optical components
IEEE Electronic Components & Technology Conference, San Diego,
pp. 208-212 (2012)

Funck, M. C., Dolkemeyer, J., Morasch, V., Loosen, P.:
Design of a miniaturized solid state laser for automated assembly
Proc. SPIE 7721, 77210X, 10 S., (2010)

Funck, M. C., Loosen, P.:
The effect of selective assembly on tolerance desensitization
Proc. SPIE 7652, 76521M, 9 S., (2010)

Leers, M., Westphalen, T., Liermann, E.:
Both sides cooled packages for high-power diode laser bars
60th Electronic Components and Technology Conference (ECTC), Las Vegas, IEEE, pp. 708-712, (2010)

Leers, M., Liermann, E., Imgrund, P., Kramer, L., Volkert, J.:
Expansion matched heat sinks made by mu-metal injection molding
Proc. SPIE 7583, 75830H, 11 S., (2010)

Miesner, J., Timmermann, A., Meinschien, J., Neumann, B., Wright, S., Tekin, T., Schröder, H., Westphalen, T., Frischkorn, F.:
Automated assembly of Fast Axis Collimation (FAC) lenses for diode laser bar modules
Proc. SPIE
7198, 71980G, 10 S., (2009)

Leers, M., Westphalen, T., Pathak, R., Scholz, C.:
Investigation of n-side cooling in regards to bar geometry and packaging style of diode laser
Proc. SPIE 7198, 71980H, 9 S., (2009)

Schmidt, H., Rota, A. C., Imgrund, P., Leers, M.:
Micro metal injection moulding for thermal management applications using ultrafine powders
Powder Injection Moulding Int. 3, Nr. 2, 55-59, (2009)

Westphalen, T., Leers, M., Werner, M., Traub, M., Hoffmann, H.-D., Ostendorf, R.:
Packaging influence on laser bars of different dimensions
Proc. SPIE 7198, 71980K, 8 S., (2009)

Brecher, C., Pyschny, N., Loosen, P., Funck, M., Morasch, V., Schmitt, R., Pavim, A.:
Self-optimising flexible assembly systems
Self-x in Engineering. Benjamin Klöpper, Wilhelm Dangelmaier (Eds.)
Münster: MV-Wissenschaft, pp. 23-38, (2009)