Electronics and Micro System Technology

Further miniaturization and greater integration are driving the relevant trends in electronics. Thanks to the successful development of EUV lithography, Moore's Law continues to be valid – with even smaller structures. To implement and evaluate this technology, the experts of Fraunhofer ILT are developing the necessary beam sources and the corresponding measuring technology.

Not only is generating structures on a nanometer scale important, but the assembly and connection technology for high-performance electronic components also plays a decisive role in this sector. Fraunhofer ILT is able to meet the increasing demands – for higher integration density and higher operating temperatures, combined with greater robustness – by employing new interconnection technologies used in the backend as well as in the power sector of electronic components. This applies in particular to e-mobility, in which high current carrying capacity is coupled with small installation space. Together with industrial partners, Fraunhofer ILT is developing new bonding techniques for battery contacts and IGBT power components, which will be integrated into high-performance manufacturing systems.

Other competencies of Fraunhofer ILT include the structuring and functionalization of surfaces as well as 3D volume structuring. For example, selective laser etching allows microscopic structures to be incorporated into glass or sapphire substrates to generate microfluidic systems for biochemical analysis.

EUV laser for high-resolution spectroscopy and lithography

EUV source system FS5420.
© Fraunhofer ILT, Aachen, Germany.

EUV source system FS5420.

High, medium or pulsed irradiation intensities in extreme ultraviolet (EUV) need to be made available for many applications in electronics and microsystem technology. The spectral range around 13.5 nm is particularly important since structures relevant to chips for the semiconductor industry can be generated or analyzed with this appropriate laser radiation.

Fraunhofer ILT is developing highly efficient EUV beam sources for high-resolution spectroscopy and nanoscale interference lithography at wavelengths in the range of 5 nm to 50 nm. This technology can be used to characterize optics, conduct contamination studies or develop new photoresists. In addition, EUV laser radiation can be used to characterize ultra-thin membranes with thicknesses of about 20 nm, multilayer systems with single-layer thicknesses of less than 1 nm and periodic lattice structures with respect to their geometry down into the subnanometer range. Membrane samples and multilayer systems can also be analyzed with stoichiometry.

Laser technology for robust opto-mechanical components and systems

LIDAR beam source in test operation.
© Fraunhofer ILT, Aachen, Germany.

LIDAR beam source in test operation.

Fraunhofer ILT develops laser-based soldering processes as well as precise, safe assembly concepts for the efficient construction of opto-mechanical components that are particularly robust and suitable for extremely demanding environmental conditions. As the process can be precisely adjusted, complex laser systems can be constructed that are stable in the long term and can be used in industry and research. For this purpose, Fraunhofer ILT has developed a versatile and precise construction technology that uses the »Pick & Align« process. Thanks to active soldering, for example, the technology can produce assemblies of optical, ceramic and metallic components. The solder joints are resistant and free of organic substances, and the systems constructed with them are characterized by particularly high tilting stabilities and temperature resistance.

The services offered by Fraunhofer ILT range from FEM analyses and design validation to the construction of prototypes and environmental tests.

Project Results 2017

Here you will find a selection of current collaborative projects

“ADIR”

Next generation urban mining - Automated disassembly, separation and recovery of valuable materials from electronic equipment

“CeGlaFlex”

Process Chain for Form-Flexible Ceramic and Glass-Based Switching and Display Elements

“i-Recycle”

“PhotonFlex”

Innovative technologies for manufacturing organic solar cells

“SeQuLas”

Absorber-Free Laser Welding of Thermoplastics

Contact

Dipl.-Ing. Hans-Dieter Hoffmann

“Lasers and Optics”

 

Telephone +49 241 8906-206
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Dr.-Ing. Arnold Gillner

“Ablation and Joining”

 

Telephone +49 241 8906-148
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Prof. Dr.-Ing. Johannes Henrich Schleifenbaum

“Additive Manufacturing
and Functional Layers”

 

Telephone +49 241 8906-398
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Prof. Dr. rer. nat. Reinhard Noll

“Measurement Technology
and EUV Sources”

 

Telephone +49 241 8906-138
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