Laser beam micro-welding is used in laser bonding as the joining process. In contrast to conventional ultrasonic bonding, the microwelding process places lower demands upon surface qualities and cleaning processes. In addition, this process provides greater independence from the substructure and vibration behavior of the workpiece. Moreover, existing bonders can be converted to combine the laser-beam bonding process with conventional bonding technology.
Especially for copper materials, the use of combined bonding technology opens up new possibilities. Thanks to the use of modern laser beam sources with a very good beam quality, copper and aluminum materials, for example, can be precisely and reproducibly joined. In addition, the laser process can be expanded with an oscillation welding process, which allows for higher bonding forces when processing wires and ribbons, thus opening up new applications for the process.