As the integration density in hermetically sealed microsystems increases, for example in the manufacture of OLEDs, and as the demands on the robustness of microsystems rise, the packaging of glass and electronic components has become more and more important. With laser-based soldering, the energy required to connect such components can be concentrated and confined in the material while keeping the overall system heat low. As a result, compact components can be produced efficiently and have long-term stability. Among other things, Fraunhofer ILT develops the packaging of large-format, hermetic glass-glass composites and dissimilar materials such as ceramics and glass or silicon and glass.
When laser radiation is used for soft soldering and brazing, components sensitive to touch and temperature can be joined at low energy consumption: for electronics, photovoltaics and medical technology. Within the context of Industry 4.0, Fraunhofer ILT is also developing algorithms for process control and quality control for soldering applications in material processing. Online detection of the heat radiation with pyrometric sensors and a power control can be used to keep the temperature of the laser joining process constant or to individually adjust it in real time even under changing process conditions.
The services offered range from customer-specific design of optics and machining heads for laser soldering, individual process development, their integration in industrial plant engineering, services in the areas of simulation and diagnostics as well as comprehensive consulting.