Soldering

Our Service

As the integration density in hermetically sealed microsystems increases, for example in the manufacture of OLEDs, and as the demands on the robustness of microsystems rise, the packaging of glass and electronic components has become more and more important. With laser-based soldering, the energy required to connect such components can be concentrated and confined in the material while keeping the overall system heat low. As a result, compact components can be produced efficiently and have long-term stability. Among other things, Fraunhofer ILT develops the packaging of large-format, hermetic glass-glass composites and dissimilar materials such as ceramics and glass or silicon and glass.

When laser radiation is used for soft soldering and brazing, components sensitive to touch and temperature can be joined at low energy consumption: for electronics, photovoltaics and medical technology. Within the context of Industry 4.0, Fraunhofer ILT is also developing algorithms for process control and quality control for soldering applications in material processing. Online detection of the heat radiation with pyrometric sensors and a power control can be used to keep the temperature of the laser joining process constant or to individually adjust it in real time even under changing process conditions.

The services offered range from customer-specific design of optics and machining heads for laser soldering, individual process development, their integration in industrial plant engineering, services in the areas of simulation and diagnostics as well as comprehensive consulting.

Ceramic circuit board with laser soldered contacts.
© Fraunhofer ILT, Aachen, Germany.

Ceramic circuit board with laser soldered contacts.

Glass-metal connections consisting of a borosilicate glass lid and a Kovar sleeve.
© Fraunhofer ILT, Aachen, Germany.

Glass-metal connections consisting of a borosilicate glass lid and a Kovar sleeve.

Laser beam soldered cell connector with tensile strength of > 4 N.
© Fraunhofer ILT, Aachen, Germany.

Laser beam soldered cell connector with tensile strength of > 4 N.

Soldering

  • Soldering of electrical components
  • Laser beam soldering in photovoltaics for the electrical interconnection of solar cells

Brazing

  • Brazing of sensitive inserts in tool industries
  • Brazing in sensor technologies for high temperature applications
  • Brazing of complex sheet metal structural components

Transient-Liquid-Phase Bonding (TLP Bonding)

  • Laser-TLP Bonding as an innovative technique for an overall contact of thermally loaded components

Glass Soldering

  • Large sized, hermetical sealing of glass-glass composites (up to 100 x 100 mm²)
  • Packaging of dissimilar materials for sensor applications (ceramic-glass, silicon-glass)

System Technology and Optical Design for Soldering Applications

  • Optical design of processing optics for soldering and brazing
  • Design of process control algorithms for soldering applications based on pyrometric and camera-based sensors
  • Online quality control during laser beam brazing for the detection of seam defects in the automotive sector

Brochures

Our brochures offer a quick view onto the service portfolio “Soldering“. Find more detailed information in the “project results“ tab.

 

Brochure “Processing Glass with Laser Radiation“

 

Brochure “Laser Technology in Photovoltaics“

 

Brochure “Micro Joining with Laser Radiation“

 

Brochure “Process Control in Laser Materials Processing“

Publications

Britten, S. W., Fiedler, W., Olowinsky, A., Gillner, A.:
Extension of the process boundaries for the soldering of elongated interconnectors with a simultaneous energy deposition
Journal of Laser Applications 27 (S2), 22005 (2015)

Mincuzzi, G., Vesce, L., Schulz-Ruhtenberg, M., Gehlen, E., Reale, A., Di Carlo, A., Brown, T. M.:
Taking temperature processing out of dye-sensitized solar cell fabrication: Fully laser-manufactured devices
Adv. Energy Mat. 4, 1400421 (8 S.) (2014)

Britten, S., Olowinsky, A. Gillner, A.:
Stress-minimized laser soldering of h-pattern multicrystalline silicon solar cells
Physics Procedia  41, 153-163 (2013)

Ungers, M., Fecker, D., Frank, S., Donst, D., Märgner, V., Abels, P., Kaierle, S.
In-situ quality monitoring during laser brazing
Physics Procedia 5, Nr 2, 493-503
2010

J. Diettrich, J. Stollenwerk, M. Kogel-Hollacher, M. Traub, C. Schnitzler
Coaxial laser brazing head
Proceedings of the Fifth International WLT-Conference on Lasers in Manufacturing 2009, Munich, June 2009
Stuttgart: AT Fachverl.
1-5, 2009