CeGlaFlex project: wafer-thin, unbreakable and flexible ceramic and glass

Press Release / 24.4.2017

Only twice as thick as a strand of hair, or around 100 µm: that’s how thin the transparent, scratchproof and malleable ceramic layers of the future that are meant to protect portable electronics are. Since March 2017, the methods and process chains for producing this material have been in development at the Fraunhofer Institute for Laser Technology ILT as part of a three-year research project called CeGlaFlex.