Packaging

Optomechanically and thermo-mechanically stable laser systems are required wherever classic construction technology reaches its limits. Many applications need such particularly robust systems, which must function reliably under extreme environmental conditions, for example. Mounting processes based on soldering technology for optical and optomechanical components allow the construction of systems suitable for aerospace applications. With its »Future Laser System« (FULAS), Fraunhofer ILT has developed a corresponding technology platform for future satellite-based LIDAR systems. On the basis of this platform, laser systems that detect trace gases in the atmosphere can be designed and constructed specific to a required task. In addition to space applications, the soldering technology can also be used advantageously for classical industrial and research applications, where – in addition to the stability – a low outgassing rate, a favorable aging behavior or good heat conduction of the mounting interface are required. The assembly technology is based on the flexible Pick & Align process developed at Fraunhofer ILT, in which all essential adjustment steps are performed with manually guided robots. In addition to new concepts, the simplification of already existing soldering processes and packages will be promoted.

The range of services encompasses feasibility studies, the development of assembly processes or functional assemblies and their qualification as well as consultancy in the conceptual design of processes and plants.

Design

• Concept development for the assembly of laser systems and optical systems
• Simulation analysis (thermal, mechanical, optical, electrical)

Assembly processes

• Thin film processes for solder layer generation (PVD)
• Pick & Align - active alignment of optical components
• Reflow soldering processes
• Active soldering processes
• Gripper development
• Planar assembly methods

Component assembly

• Laser crystals
• Nonlinear Crystals
• Mirrors and lenses
• Fiber components
• Soldering of optomechanical assemblies
• Construction of hybrid assemblies up to complex prototypes

Quality inspection/Qualification

• Temperature cycle tests incl. autocollimator measurement
• Vibration and shock tests incl. autocollimator measurement
• Modal analysis
• Shear test
• Tensile test
• Metallurgical investigations
• EDX and scanning electron microscopy
• Measurement of stress birefringence

Hesker, M., Bonhoff, A., Holly, C.:
Flexibles optisches Modul mit zwei kaskadierten Phasenmodulatoren (LCoS-SLM) für die Hochleistungs-Ultrakurzpuls-Lasermaterialbearbeitung.
126. Jahrestagung der Deutschen Gesellschaft für angewandte Optik e. V., 11.06 - 14. 06.2025, Stuttgart. DGaO-Proceedings A21, (2 S.), (2025)
https://www.dgao-proceedings.de/download/126/126_a21.pdf

Esser, D., Giesberts, M., Erben, B., Nyga, S., Kasemann, R., Wührer, C., Hahn, S., Leyendecker, M., Eßer, J., Wirz, W., Klein, S., Traub, M., Klein, J., Brandenburg, W., Luttmann, K., Mohr, D., Pérez Prieto, L., Hoffmann, H.-D,
Optomechanical design of a 150 mJ single frequency UV laser for the AEOLUS-2 mission.
International Conference on Space Optics — ICSO 2022, 3-7 October 2022, Dubrovnik, Croatia. Proceedings Volume 12777, International Conference on Space Optics — ICSO 2022; 127770N (2023).
https://doi.org/10.1117/12.2688830

Livrozet, M., Gronloh, B., Faidel, H., Luttmann, J., Hoffmann, D.:
Optical and Optomechanical Design of the MERLIN Laser Optical Bench.
International Conference on Space Optics — ICSO 2021| 30 March - 2 April 2021 | Online Only. Proceedings Volume 11852, International Conference on Space Optics — ICSO 2020; 118522Q- (14 S.) (2021)
https://doi.org/10.1117/12.2599445

Holters, M., Dirks, S., Stollenwerk, J., Loosen, P.:
Automated and model-based assembly of an anamorphic telescope.
SPIE OPTO, 22 February 2018, San Francisco, California, United States.
Proc. SPIE 10538, Optical Interconnects XVIII, 105380U (10 S.) (2018)
https://doi.org/10.1117/12.2291910

Löhring, J., Winzen, M., Faidel, H., Miesner, J., Plum, D., Klein, J., Fitzau, O., Giesberts, M.,
Brandenburg, W., Seidel, A., Schwanen, N., Riesters, D., Hengesbach, S., Hoffmann, H.-D.:
Key optical components for spaceborne lasers
Proc. SPIE 9730, 97300O-1 (11 S.) (2016)
https://doi.org/10.1117/12.2212319

Livrozet, M. J., Elsen, F., Wüppen, J., Löhring, J., Büdenbender, C., Fix, A., Jungbluth, B., Hoffmann, D.:
Feasibility and performance study for a space-borne 1645 nm OPO for French-German satellite mission MERLIN
Proc. SPIE 8959, 89590G (7 S.) (2014)
https://doi.org/10.1117/12.2041422

Brecher, C., Schmitt, R., Loosen, P., Guerrero, V., Pyschny, N., Pavim, A., Gatej, A.:
Self-optimizing approach for automated laser resonator alignment 
Opt. Lasers Eng. 50, 287-292, (2012)
https://doi.org/10.1016/j.optlaseng.2011.08.001

Faidel, H., Gronloh, B., Winzen, M., Liermann, E., Esser, D., Morasch, V., Luttmann, J., Leers, M., Hoffmann, D.:
Passive alignment and soldering technique for optical components 
Proc. SPIE 8235, (10 S.) (2012)
https://doi.org/10.1117/12.906726

Gatej, A., Pyschny, N., Loosen, P., Brecher, C.:
Robot-based Resistance Soldering of Optical Components
Soldering & Surface Mount Technology Vol. 24, no. 2, pp. 112-119, (2012)
https://doi.org/10.1108/09540911211214686

Leers, M., Winzen, M., Liermann, E., Faidel, H., Westphalen, T., Miesner, J., Luttmann, J., Hoffmann, D.:
Highly precise and robust packaging of optical components
Proc. SPIE 8244, (6 S.) (2012)
https://doi.org/10.1117/12.920016

Leers, M., Winzen, M., Liermann, E., Faidel, H., Westphalen, T., Miesner, J., Luttmann, J., Hoffmann, D.:
Pick and align - high precision active alignment of optical components
IEEE Electronic Components & Technology Conference, San Diego,pp. 208-212 (2012)
https://doi.org/10.1117/12.920016

Funck, M. C., Dolkemeyer, J., Morasch, V., Loosen, P.:
Design of a miniaturized solid state laser for automated assembly
Proc. SPIE 7721, 77210X, (10 S.) (2010)
https://doi.org/10.1117/12.855017

Funck, M. C., Loosen, P.:
The effect of selective assembly on tolerance desensitization
Proc. SPIE 7652, 76521M, (9 S.) (2010)
https://doi.org/10.1117/12.868922

Leers, M., Westphalen, T., Liermann, E.:
Both sides cooled packages for high-power diode laser bars
60th Electronic Components and Technology Conference (ECTC), Las Vegas, IEEE, pp. 708-712, (2010)
https://doi.org/10.1109/ECTC.2010.5490770

Leers, M., Liermann, E., Imgrund, P., Kramer, L., Volkert, J.:
Expansion matched heat sinks made by μ-metal injection molding
Proc. SPIE 7583, 75830H, (11 S.) (2010)
https://doi.org/10.1117/12.842064

Miesner, J., Timmermann, A., Meinschien, J., Neumann, B., Wright, S., Tekin, T., Schröder, H., Westphalen, T., Frischkorn, F.:
Automated assembly of Fast Axis Collimation (FAC) lenses for diode laser bar modules
Proc. SPIE7198, 71980G, (10 S.) (2009)
https://doi.org/10.1117/12.809190

Leers, M., Westphalen, T., Pathak, R., Scholz, C.:
Investigation of n-side cooling in regards to bar geometry and packaging style of diode laser
Proc. SPIE 7198, 71980H, (9 S.) (2009)
https://doi.org/10.1117/12.809508

Schmidt, H., Rota, A. C., Imgrund, P., Leers, M.:
Micro metal injection moulding for thermal management applications using ultrafine powders
Powder Injection Moulding Int. 3, Nr. 2, 55-59, (2009)

Westphalen, T., Leers, M., Werner, M., Traub, M., Hoffmann, H.-D., Ostendorf, R.:
Packaging influence on laser bars of different dimensions
Proc. SPIE 7198, 71980K, (8 S.) (2009)
https://doi.org/10.1117/12.810483

Brecher, C., Pyschny, N., Loosen, P., Funck, M., Morasch, V., Schmitt, R., Pavim, A.:
Self-optimising flexible assembly systems
Self-x in Engineering. Benjamin Klöpper, Wilhelm Dangelmaier (Eds.)
Münster: MV-Wissenschaft, pp. 23-38, (2009)

Our services cover a wide range of topics. Related topics to packaging and further research and development focuses can be found under the following links.