Laser Material Processing

Process Sensorics

• High speed camera, photron SA5 image rate of approx. 100,000 f/s, working memory 32 GB
• Photocathode image amplifier for high speed video cameras
• NIR camera, XEVAS HS image rate of 350 f/s
• PhotonFocus high speed digital CMOS surface cameras
• Dalsa RGB line camera
• High power LED illumination system
• Illumination laser 810 nm, 532 nm
• CPC (coaxial process control), flexible, modular optical system for 
  integration in laser processing plants
• Amtron pyrometer for low temperatures, measuring rate 1 ms
• Fast Kleiber pyrometer, measuring rate 0.01 ms
• Shack Harmann sensor for wave front measurement
• Circular shape testing device for dynamic measurement of processing plants
• Powder gas-stream testing station to measure and characterize nozzles for generative processes
• Full radiator

• Reis robot processing plant with beam guiding and MSG source for hybrid welding
• ZEMAX, software for optical system design
• MATLAB, software for algorithm development for image processing

Thin Films and Cleaning

• Scanner installation with diode lasers (continuous: 980 nm at 150 W, 1,470 nm at 60 W, 1,920 nm at 20 W; pulsed: 980, tp = 5 – 20 µs , f = 5,000 – 30,000 Hz, Ep < 10 mJ)
• High-speed handling system (maximum speed: 5 m/s, length 2.1 m)
• Flow box with dip coater
• Nano indenter (Δxy = ± 4 µm, F = 0.05 – 500 mN)
• Pipe-jet printer
• Inkjet printer
• Erbium color laser 1,550 nm with scanner and optics, 100W, cw
• Nd:YAG laser (pulsed) with high pulse-to-pulse stability, 40W mean power, 20 – 200 kHz repitition rate, 18 – 80 ns pulse length, with scanner and optics
• High power Q-switched Nd:YAG laser system with 2 x 1,000-W mean output power, fiber-coupled in 2 x 600-µm fibers, in combination with diverse 1D and 2D scanners for quick beam deflection, 30 kHz repetition rate, appox. 100 ns pulse duration
• High power Q-switched Nd:YAG laser system (built at the Fraunhofer ILT) with 1,800-W mean output power, fiber-coupled in 400-µm fiber, combined with diverse 1d and 2D scanners for quick beam deflection, 33 Hz repetition rate, approx. 100 ns pulse duration
• 1D scanner for quick beam deflection with up to 25m/s scanning speed (built at the Fraunhofer ILT)
• Assembly for online absorption measurements with Ulbricht spheres and 1GHz oscilloscope
• Diverse optics for beam forming and focussing

Polishing

• Laboratory machine for laser polishing of metals with five mechanical and three optical axes for work pieces of up to 3 kg (with a 400-W rod laser)
• Tool machine for laser polishing with five mechanical and three optical axes for work pieces of up to 200 kg (with a 1000-W disc laser)
• Laboratory assembly for high dynamic overlapping of several laser beams (at 1 µm wavelength)
• Scanner assembly with power attenuator for independent adjustment of laser power and pulse duration of pulsed solid-state lasers
• Laboratory machine for laser polishing of glass and plastics with two mechanical and two optical axes (with a 1,500-W CO₂ laser)
• Oven and diverse heating plates for preheating and tempering of glass samples
• Delcam PowerMILL CAM system
• 1500-W CO₂ laser
• 1000-W disc laser, cs
• 700-W disc laser, cw and pulsed (600 – 2,000 ns)
• 400-W rod laser, cs and pulsed (100 – 500 ns)
• 40-W fiber laser, pulsed
• Diverse optics, waveguide fibers with round and quadratic cross-section
• Thermal-imaging camera, pyrometer
• Zygo NewView 7300 white light interferometer
• Mahr M2 profilometer
• Leica M205 C stereo microscope with camera

Heat Treatment and Coating / Cladding

• Fiber-coupled diode laser with 1, 2 and 10 kW output power
• 200-W fiber laser for micro processing
• Fiber-coupled Nd:YAG laser with 2 and 3 kW output power
• Fiber-coupled (100 µm) disc laser with 1 kW output power
• 12-kW CO₂ laser
• Diverse optics with fixed or variable focal lengths for beam diameters of 100 µm up to a rectangular profile of 90 x 45 mm²
• Peripheral devices for process monitoring and component measurement (cameras, pyrometers, optical scanners)
• Diverse powder conveyors for feeding power grain fractions between 20 and 150 µm
• Powder conveyor for feeding powder grain fractions < 20 µm
• Vibrating screen and mixer for power preparation and processing
• Precise three-axis handling system for micro processing
• Compact five-axis handling system for coating (mobile operation possible)
• Glove box with integrated four-axis handling system for laser processing in a protective gas atmosphere ( < 10 ppm residual oxygen)
• Five-axis portal system for laser processing of large work pieces
• Four x four-axis handling system for coating and heat treatment
• Heating plate for preheating up to 900 °C
• Protective gas oven for temperatures of up to 1,300 °C for post heat-treatment
• Five (+two)-axis cantilever plant
• TRUMPT TLC 1005 plant
• Metallography laboratory with light microscopy, scanning electron microscopy and EDX analysis
• Low load and macro hardness testing

Rapid Manufacturing

• EOSint M270
• Trumaform SLM plant with platform heating of up to 500 °C and a 500-W fiber laser
• Trumaform SML plant with platform heating up to 500 °C and a 1,000-W fiber laser
• Two SML laboratory plants with platform heating of up to 500 °C

• SLM laser beam sources (single mode fiber laser) with 200 W and 1,000 W
• SLM laboratory plant with CO₂ laser beam source up to 600 W for processing of (bio)polymers and ceramics
• SLM laboratory plant with inductive platform heaing up to 1,200 °C as well as beam heating up to 1,700 °C for processing of high-temperature materials and ceramics
• Powder sieves and powder mills for power preparation
• Drum-deburring device for surface smoothing of SLM components
• Diverse systems and optics for coaxial on-line process monitoring

Microjoining

• Disk laser, λ = 1030 nm, 1 kW, 50/200 μm fiber
• Nd:YAG laser, λ = 1064 nm, 60 W pulsed, 0,1 - 20 ms
• Nd:YAG laser, λ = 1064 nm, 400 W, 0,1 - 50 ms,
• Diode laser, λ = 808/940 nm, up to 500 W, 600 μm fiber
• Diode laser, λ = 980 nm, 100 W, 200 μm fiber
• Diode laser, λ = 1.5 μm, 600 μm fiber
• Diode laser, λ = 800 nm, 4x300 W, simultaneous control, direct beam
• Fiber laser, λ = 1075 nm, 20 W, 100 W and 200 W, TEM00
• Fiber laser, λ = 1.5 μm, 100 W, TEM00
• Fiber laser, λ = 1.9 μm, 100 W, TEM00
• Laser soldering head with integrated solder wire feeder
• Galvanometer scanner with focal length from 50 mm to 566 mm
• 5-axis micro machining system with accuracy down to 1 μm
• 3-axis system with force feed back controlled z-axis
• Scara robot and jointed-arm robot
• Automated assembly cell Teamtechnik teamos
• Process monitoring system Precitec LaserWeldingMonitor LWM
• High speed imaging camera with 10,000 fps
• Climate testing chamber: - 70 °C to +180 °C
• Chamber furnace for dustfree vitrifying and tempering, max. 650 °C

Macrojoining and Cutting

• CO₂ lasers up to 20 kW
• Disc lasers up to 10 kW [Achtung. Schreibfehler im deutsch]
• Fiber lasers up to 4 kW
• Lamp and diode-pumped solid-state lasers up to 8 kW
• Diode laser systems up to 3 kW
• Trumpf 6 kW Trulaser 5030 CO₂ flat-bed laser cutting machine
• Trumpf laser cell TLC 105 with CO₂ laser TLF2600t (with connection to LAY2006D)
•  High-power scanner up to 8 kW
•  2D high speed plant, a = 4g, v = 300m/min
•  Laser portal robot
•  Six-axis robot
•  Schuler-Held Translas 2718 Penta portal robot
•  Schuler-Held Translas 3223 Penta portal robot
•  Three-axis processing stations
•  Varilas (Held) three-axis side-head machine
•  MOBO mobile laser processing station
•  Reis RV16 robotic working cell with rotary table
•  Beam guidance systems
•  Beam diagnosis devices for high-power lasers (microspot monitor, focus monitor)
•  Various processing heads for welding and cutting
•  Comibhead for welding and cutting
•  Hybrid welding heads for CO₂ or solid-state lasers
•  Welding electricity sources MIG / MAG and TIG
•  Krautkramer UMS25S Lemo ultrasound testing device
•  LabVIEW real time system (data collection, control, regulation)
•  High speed camera with 100 kHz image rate
•  Smearing/Streaking diagnosis station
•  Incident light – transmitted light – microscopy and image analysis
•  Stereo microscope
•  Hardness tester (macro/micro)
•  Surface measuring device
•  Scanning electron microscope with EDX
•  White light interferometer
•  Spectrometer UV/VIS/NIR 200 nm – 2,500 nm
•  Spectrometer FT IR 2,500 nm – 30 µm
•  3D surface measuring device

Laser in Photovoltaics

• Ultra-short pulse laser, λ = 1064, 532, 355 nm, tpulse 10 ps
• Q-switched Yb:YAG disc laser, λ = 1030 nm, Pav 65 W, tpulse 1 μs
• Yb:YAG disc laser, λ = 1030 nm, Pav = 750 W, tpulse 1 μs, fiber guided
• Short-pulse laser, λ = 355 nm, Pav = 10 W, tpulse 35 ns
• Nd:YAG laser, λ = 1064 nm, Pav = 60 W, Ppulse 3 kW, tPulse 0.1 - 20 ms
• Nd:YAG laser, λ = 1064 nm, Pav = 400 W, Ppulse 8 kW, tpulse 0.1 - 50 ms
• Disc laser, λ = 1030 nm, Pav = 1 kW, cw, 50/200 μm fi bres
• Fiber laser, λ = 1075 nm, Pav = 100/200 W, cw, TEM00
• Diode laser, λ = 808/940 nm, Pav = 250 and 500 W, cw, 600 μm fiber
• Diode laser, λ = 800 nm, P = 4 x 300 W, cw, simultaneously controllable
• Galvanometeric scanners with apertures of 7 to 25 mm, focal lengths of 50 - 566 mm (e.g. for 6“ work fields)
• 5-axis machining systems with precision down to less than 1 μm
• Climate chamber -70 °C to +180 °C
• Wafer test system (photoconductance decay) with Suns-Voc station
• Digital light microscope with up to 1000 x magnification
• Scanning electron microscope
• White light interferometer
• Process control Precitec LaserWeldingMonitor LWM
• High-speed camera with 10 kHz frame rate
• Thermographic camera varioTHERM® with 50 Hz frame rate
• Universal tensile testing machine 10 N to 100 kN

Plastics Technology

• Disk Laser, λ = 1030 nm, P = 1 kW, cw, fiber diameter 50/200 μm
• Fiber Laser, λ = 1075 nm, P = 100/200 W, cw, TEM00
• Fiber Laser, λ = 1080 nm, P = 20 W, cw
• Diode Laser modules with output powers < 70 W
• Wavelengths 808, 940, 980, 1490, 1710 und 1908 nm
• Mask polymer welding machine
• 6-axis assembly robot
• CO₂ Laser, λ = 10.6 μm, P = 120 W avg., P = 600 W peak power
• Galvo-Scanner for CO₂, v= 3000 mm/s, fi eld size 140 x 140 mm
• 2D linear-axis system, field size 800 x 800 mm
• Acusto-optical modulator for CO₂, Pmax = 400 W, rise time 1μs
• UV-VIS-NIR spectrometer
• Welding process control system