Holters, M., Dirks, S., Stollenwerk, J., Loosen, P.:
Automated and model-based assembly of an anamorphic telescope.
SPIE OPTO, 22 February 2018, San Francisco, California, United States.
Proc. SPIE 10538, Optical Interconnects XVIII, 105380U (10 S.) (2018)
Löhring, J., Winzen, M., Faidel, H., Miesner, J., Plum, D., Klein, J., Fitzau, O., Giesberts, M.,
Brandenburg, W., Seidel, A., Schwanen, N., Riesters, D., Hengesbach, S., Hoffmann, H.-D.:
Key optical components for spaceborne lasers
Proc. SPIE 9730, 97300O-1 (11 S.) (2016)
Livrozet, M. J., Elsen, F., Wüppen, J., Löhring, J., Büdenbender, C., Fix, A., Jungbluth, B., Hoffmann, D.:
Feasibility and performance study for a space-borne 1645 nm OPO for French-German satellite mission MERLIN
Proc. SPIE 8959, 89590G (7 S.) (2014)
Brecher, C., Schmitt, R., Loosen, P., Guerrero, V., Pyschny, N., Pavim, A., Gatej, A.:
Self-optimizing approach for automated laser resonator alignment
Opt. Lasers Eng. 50, 287-292, (2012)
Faidel, H., Gronloh, B., Winzen, M., Liermann, E., Esser, D., Morasch, V., Luttmann, J., Leers, M., Hoffmann, D.:
Passive alignment and soldering technique for optical components
Proc. SPIE 8235, (10 S.) (2012)
Gatej, A., Pyschny, N., Loosen, P., Brecher, C.:
Robot-based Resistance Soldering of Optical Components
Soldering & Surface Mount Technology Vol. 24, no. 2, pp. 112-119, (2012)
Leers, M., Winzen, M., Liermann, E., Faidel, H., Westphalen, T., Miesner, J., Luttmann, J., Hoffmann, D.:
Highly precise and robust packaging of optical components
Proc. SPIE 8244, (6 S.) (2012)
Leers, M., Winzen, M., Liermann, E., Faidel, H., Westphalen, T., Miesner, J., Luttmann, J., Hoffmann, D.:
Pick and align - high precision active alignment of optical components
IEEE Electronic Components & Technology Conference, San Diego,
pp. 208-212 (2012)
Funck, M. C., Dolkemeyer, J., Morasch, V., Loosen, P.:
Design of a miniaturized solid state laser for automated assembly
Proc. SPIE 7721, 77210X, (10 S.) (2010)
Funck, M. C., Loosen, P.:
The effect of selective assembly on tolerance desensitization
Proc. SPIE 7652, 76521M, (9 S.) (2010)
Leers, M., Westphalen, T., Liermann, E.:
Both sides cooled packages for high-power diode laser bars
60th Electronic Components and Technology Conference (ECTC), Las Vegas, IEEE, pp. 708-712, (2010)
Leers, M., Liermann, E., Imgrund, P., Kramer, L., Volkert, J.:
Expansion matched heat sinks made by mu-metal injection molding
Proc. SPIE 7583, 75830H, (11 S.) (2010)
Miesner, J., Timmermann, A., Meinschien, J., Neumann, B., Wright, S., Tekin, T., Schröder, H., Westphalen, T., Frischkorn, F.:
Automated assembly of Fast Axis Collimation (FAC) lenses for diode laser bar modules
Proc. SPIE
7198, 71980G, (10 S.) (2009)
Leers, M., Westphalen, T., Pathak, R., Scholz, C.:
Investigation of n-side cooling in regards to bar geometry and packaging style of diode laser
Proc. SPIE 7198, 71980H, (9 S.) (2009)
Schmidt, H., Rota, A. C., Imgrund, P., Leers, M.:
Micro metal injection moulding for thermal management applications using ultrafine powders
Powder Injection Moulding Int. 3, Nr. 2, 55-59, (2009)
Westphalen, T., Leers, M., Werner, M., Traub, M., Hoffmann, H.-D., Ostendorf, R.:
Packaging influence on laser bars of different dimensions
Proc. SPIE 7198, 71980K, (8 S.) (2009)
Brecher, C., Pyschny, N., Loosen, P., Funck, M., Morasch, V., Schmitt, R., Pavim, A.:
Self-optimising flexible assembly systems
Self-x in Engineering. Benjamin Klöpper, Wilhelm Dangelmaier (Eds.)
Münster: MV-Wissenschaft, pp. 23-38, (2009)