"eHarsh Seminar" Program

Registration

Registration deadline:
November 22, 2021

"eHarsh Seminar" - Homepage

"Micro Joining" at
Fraunhofer ILT

Fraunhofer Leitprojekt »eHarsh«

Program

DAY 1: Monday, November 29, 2021
virtually via MS Teams

The lectures will be held in English.

Status: November 2021

 

Session of the Fraunhofer ILT | Moderation: Holger Kappert

12:30 Login MS Teams
13:00 Introduction to Fraunhofer Lighthouse project "Sensorsystems for extreme harsh environments" (eHarsh)
Holger Kappert, Fraunhofer IMS, Duisburg (D)
13:30 Introduction to Fraunhofer ILT
Dr. Alexander Olowinsky, Fraunhofer ILT, Aachen (D)
13:35 Use of thermo-mechanical simulations for joining technology and component design
Dr. Mirko Aden, Fraunhofer ILT, Aachen (D)
14:05 Glass-to-metal compression seals for the manufacture of helium-tight ceramic multilayer feedthroughs
Heidrun Kind, Fraunhofer ILT, Aachen (D)
14:35
Laser based Joining of metallic components with dissimilar coefficients of thermal expansion
Dr. André Häusler, Fraunhofer ILT, Aachen (D)
15:05 Printed and laser based production of electrical functional layers
Dr. Christian Vedder, Fraunhofer ILT, Aachen (D)
15:35 Break
15:45
Virtual Lab-Tour at Fraunhofer ILT
Manufacture of laser-based glass feedthroughs and laser beam microwelding of metals
16:15 End of the lectures
   
Programm subject to minor changes.

DAY 2: Thursday, November 30, 2021

virtually via MS Teams

The lectures will be held in English.

Status: November 2021

 

Session of the Fraunhofer IPM und EMI | Moderation: Holger Kappert

12:30 Login MS Teams
13:00 Introduction to Fraunhofer Lighthouse project "Sensorsystems for extreme harsh environments" (eHarsh)
Holger Kappert, Fraunhofer IMS, Duisburg (D)
13:10 Introduction to the Fraunhofer IPM
Martin Jägle, Fraunhofer IPM, Freiburg im Breisgau (D)
13:15 Thermal-Electrical Impedance Spectroscopy
Martin Jägle, Fraunhofer IPM, Freiburg im Breisgau (D)
13:45 Setup for High Pressure Tests at High Temperature
Martin Jägle, Fraunhofer IPM, Freiburg im Breisgau (D)
14:15 Break
14:25 Introduction to the Fraunhofer EMI
Dr. Sebastian Schopferer, Fraunhofer EMI, Efringen-Kirchen  (D)
14:30 Test stand for combined temperature / vibration loads
Dilara Mert, Fraunhofer EMI, Efringen-Kirchen  (D)
15:00
Dynamic pressure sensor characterization by shock tube tests
Dr. Sebastian Schopferer, Fraunhofer EMI, Efringen-Kirchen  (D)
15:30
Virtual Lab-Tour at Fraunhofer IPM
HE-Lab
16:00 End of the lectures
   
Program subject to minor changes.

DAY 3: Wednesday, December 1, 2021

virtually via MS Teams

The lectures will be held in English.

Status: November 2021



 

Session of the Fraunhofer IMS und IZM | Moderation:Dr. Alexander Olowinsky

12:30 Login MS Teams
13:00 Introduction to Fraunhofer Lighthouse project "Sensorsystems for extreme harsh environments" (eHarsh)
Holger Kappert, Fraunhofer IMS, Duisburg (D)
13:10 Introduction to the Fraunhofer IMS
Holger Kappert, Fraunhofer IMS, Duisburg (D)
13:15 High temperature CMOS and MEMS technologies
Dr. Stefan Dreiner, Fraunhofer IMS, Duisburg (D)
13.45 High temperature integrated sensor electronics
Dr. Norbert Kordas, Fraunhofer IMS, Duisburg (D)
14:15 Break
14:25
Introduction to the Fraunhofer IZM
Malte Spanier, Fraunhofer IZM, Berlin (D)
14:30 Embedding technology for SMD components in printed circuit boards
David Schütze, Fraunhofer IZM, Berlin (D)
15:00 Assembly and interconnection technology within the eHarsh project
Malte Spanier, Fraunhofer IZM, Berlin (D)
15:30 Flip Chip silver sintering
Olaf Rämer, Fraunhofer IZM, Berlin (D)
16:00 End of the lectures
   
Programm subject to minor changes.

DAY 4: Thursday, Dezember 2, 2021

virtually via MS Teams

The lectures will be held in English.

Status: November 2021



 

Session of the Fraunhofer IKTS | Moderation:Dr. Alexander Olowinsky

12.30 Login MS Teams
13:00 Introduction to Fraunhofer Lighthouse project "Sensorsystems for extreme harsh environments" (eHarsh)
Holger Kappert, Fraunhofer IMS, Duisburg (D)
13:10 Introduction to the Fraunhofer IKTS
Dr. Steffen Ziesche, Fraunhofer IKTS, Dresden (D)
13:15 Thick Film and Multilayer Ceramic Technology
Dr. Steffen Ziesche, Fraunhofer IKTS, Dresden (D)
13:45 Pressure sensors manufactured in Multilayer Ceramic Technology
Adrian Goldberg, Fraunhofer IKTS, Dresden (D)
14:15 Break
14:45 Multilayer ceramic-based circuit boards
Martin Ihle, Fraunhofer IKTS, Dresden (D)
14:55 Virtual Lab-Tour at the Fraunhofer IKTS
Multilayer Ceramic manufacturing lab)
15:25 End of the lectures
   
Programm subject to minor changes.

DAY 5: Friday, December 3,  2021
virtually via MS Teams

The lectures will be held in English.

Status: November 2021

 

 

Session of the Fraunhofer ENAS und IMWS | Moderation: Holger Kappert

12.30 Login MS Teams
13:00 Introduction to Fraunhofer Lighthouse project "Sensorsystems for extreme harsh environments" (eHarsh)
Holger Kappert, Fraunhofer IMS, Duisburg (D)
13:10 Introduction to the Fraunhofer IMWS
Frank Altmann, Fraunhofer IMWS, Halle (D)
13:15 Characterization and micro structure analyzes on materials and components for harsh environments
Falk Naumann, Fraunhofer IMWS, Halle (D)
13:40 Virtual Lab-Tour at the Fraunhofer IMWS
Fraunhofer IMWS, Halle (D)
14:05 Break
14:20
Introduction to the Fraunhofer ENAS
Dr. Maik Wiemer, Fraunhofer ENAS, Chemnitz (D)
14:25 CMUT ultrasonic transducer: Development and Characterization 
Dr. Nooshin Saeidi, Fraunhofer ENAS, Chemnitz (D)
14:50 Evaluation of the thermomechanical reliability of electronic systems by means of "virtual prototyping"
Ralf Döring, Fraunhofer ENAS, Chemnitz (D)
15:15 Virutal Lab-Tour at the Fraunhofer ENAS
15:40 Outlook
Holger Kappert, Fraunhofer IMS, Duisburg (D)
15:55 End of the seminar
   
Programm subject to minor changes.

Registration

Registration deadline:
November 22, 2021

"eHarsh Seminar" - Homepage