12,000 holes per second with 1 µm diameter

Press Release / March 13, 2019

A new generation of ultrafast process technology is on the market. Higher average laser power and greater pulse energy promise higher throughput and efficiency. When processing microfilters, for example, this makes it possible to drill hole sizes down to below one micrometer much more quickly. When scaling the processes, there are some non-trivial interaction mechanisms to contend with, which were one of the topics of the “5th UKP-Workshop: Ultrafast Laser Technology“ in Aachen.